X-ray

2022 Circuits Assembly NPI Award

VJ Electronix Wins 2022 NPI Award for X-ray Inspection

News, Press & Media, X-ray / By

FOR IMMEDIATE RELEASE VJ Electronix accepts 25th industry award in less than 20 years! February 2022 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce that it received a 2022 CIRCUITS ASSEMBLY NPI Award in the category of Test and […]

VJ Electronix Wins 2022 NPI Award for X-ray Inspection Read More »

FOR IMMEDIATE RELEASE VJ Electronix accepts 25th industry award in less than 20 years! February 2022 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce that it received a 2022 CIRCUITS ASSEMBLY NPI Award in the category of Test and

Eliminate Costly Component Out Of Pocket Defect Condition during Semiconductor IC Transport/Handling

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Rich Rochford, Electronic Combat Solutions, BAE Systems Nashua, NH Richard.Rochford@baesystems.com Craig Blanchette, Electronic Combat Solutions BAE Systems Nashua, NH Craig.Blanchette@baesystems.com Abstract—High value devices used in microwave modules and other microelectronic assemblies have become increasingly thin and susceptible to “Component Out Of Pocket” (COOP) conditions that may occur during packaging, shipping, and customer handling. This defect

Eliminate Costly Component Out Of Pocket Defect Condition during Semiconductor IC Transport/Handling Read More »

Rich Rochford, Electronic Combat Solutions, BAE Systems Nashua, NH Richard.Rochford@baesystems.com Craig Blanchette, Electronic Combat Solutions BAE Systems Nashua, NH Craig.Blanchette@baesystems.com Abstract—High value devices used in microwave modules and other microelectronic assemblies have become increasingly thin and susceptible to “Component Out Of Pocket” (COOP) conditions that may occur during packaging, shipping, and customer handling. This defect

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