SUMMIT LXi Auto
Automated alignment rework system for components up to 100 x 100 mm
The go-to rework system for 5G, and large board applications. The Summit LXi Auto is designed to simplify alignment of very large, expensive components.
Built with easy-to-use 1-2-3-GO Software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity, and a replaceable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis, and sharing of profiles between VJE Systems.
Features
Easy-To-Use Auto Profiling Software
- User-friendly, simple thermal profile development
- Default reflow profiles for standard rework processes
- Advanced profile analysis software confirms successful profile development
- Automatic reflow, remove, and replace scavenging sequences
Simple Component-to-Site Alignment
- Two-color LED optical alignment with automatic fiducial based component alignment
- Motorized and programmable Z and Theta axis minimizes operator intervention
- Motorized and programmable X-Y table (option) for simplified component alignment
Repeatable Thermal Performance
- Efficient Convection Heaters provide high thermal uniformity
- Board conditioning (preheat) is temperature based via thermocouples allowing for precise temperature measurements
Automatic Non-Contact Site Scavenging
- Dynamic Height Sensing (DHS) Scavenger maintains consistent scavenger tip to board gap safely removing residual solder
- Programmable X,Y, and Z axis eliminates operator intervention
- Nitrogen capability for consistent results without post scavenge cleaning
MES Interface
- Track all operations performed on rework system from automatic event log
- Reflow processes easily transferred between systems
Available Tooling for Any Surface Mount Component
- Standard nozzles for conventional components
- Special nozzles for unique components
Specifications
Technical Parameters
- Automatic, fiducial based alignment 0.0024" (60u) mean + 3σ
- Manual Placement Capability: 0.0010" (25u) mean + 3σ
- Maximum Board Size: 600 x 900mm
- Minimum Component Size: 0201 (manual alignment) 80mm (3.2") Square
- Thermocouple Jacks: 6 (14 optional)
- Theta Motion: 360°
- Top Heater: 2200W
- Area Heater: 10,000W
- Site Heater: 1000W
Request More Information
Ready to Install?
Call us to reserve (800) 858-9729
Email: electronixsales@vjt.com
